SiliconPV 2022

Konstanz, Germany
+49 761 76991820
Freiburg, Germania Germania

Dettagli Aziendali

Event Type
Data Inizio
28 mar 2022
Data Fine
01 apr 2022
Numero d'edizioni precedenti


The 12th edition of SiliconPV will take place from March 28-30, 2022 and will be hosted by the University of Konstanz, Germany.

Like in recent years, SiliconPV continues its fruitful cooperation with the nPV workshop and - like planned for 2020 - the bifiPV Workshop will join as well.

Join the SiliconPV week and keep up to date on all aspects on crystalline silicon PV, simulations/characterization, p-type and n-type solar cells, bifacial applications, bankability... and much, much more!

SiliconPV Conference from March 28-30, 2022
The conference covers a variety of exciting topics around crystalline silicon for photovoltaic application, which is still the leading technology for solar electricity generation!

nPV Workshop from March 30-31, 2022
As in the last years, we will continue our fruitful cooperation with the nPV Workshop. Taking place directly after the SiliconPV conference with one overlapping day, the workshop provides a complete overview of all trends, innovations and developments of n-type technology.
Abstracts for the nPV workshop on Wednesday are welcome and must be uploaded to the SiliconPV conference system as well.
The nPV Workshop is hosted by the University of Konstanz, Germany.

bifiPV Workshop from March 31 - April 1, 2022
In addition, this time the bifiPV Workshop on Friday will also be linked to the SiliconPV conference to enable all those who are interested to attend these events in a condensed and efficient way.
The bifiPV Workshop is hosted by ISC Konstanz, Germany.

Scientific Topics

● Silicon material and defect engineering
● Wafering technologies and direct-wafer production
● Junction formation
● Cleaning, etching, layer deposition technologies, surface morphology and surface passivation
● Carrier selective contacts, metallization and contact formation
● Advanced light management
● Advanced characterization and simulation
● High-capacitance cell and module performance testing
● Process integration and low-cost manufacturing
● New manufacturing tools
● Si-based tandem cells, new materials and novel approaches
● Module processing and materials
● Module reliability and production yield
● High and record efficiency devices
● Review papers
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